Middle member of heat dissipation device and the heat dissipation device

ABSTRACT

A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure. The channeled structure is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates generally to a middle member of heatdissipation device and the heat dissipation device, and moreparticularly to a middle member of heat dissipation device and the heatdissipation device, which includes one single plate of middle membermain body having a first face and a second face. Complex surfacestructures are disposed on the first face or the second face or both thefirst and second faces of the middle member main body to enhance thecapillary attraction.

2. Description of the Related Art

Currently, there are various heat dissipation devices. Some of the heatdissipation devices transfer and dissipate heat by way of vapor-liquidcirculation, such as heat pipe and vapor chamber. When applied to adevice with a narrow space, such as a mobile phone or an intelligentwatch, the entire structures of the heat pipe and the vapor chamber mustbe thinned in adaptation to the narrow space of the device.

Either of the heat pipe and the vapor chamber has an internal vacuumedchamber. A capillary structure is disposed in the vacuumed chamber and aworking fluid is contained in the vacuumed chamber. When heated, theliquid working fluid in the vacuumed chamber is evaporated into vapor.The vapor working fluid is then condensed into liquid working fluid.Accordingly, the working fluid is changed between vapor phase and liquidphase to transfer the heat. Therefore, the vapor passage for theevaporated working fluid to diffuse and the capillary structure for thecondensed working fluid to flow back are critical in the design of thethinned heat pipe and vapor chamber. However, when thinning the heatpipe and vapor chamber, the space of the vacuumed chamber will beinevitably narrowed. Also, the structural strength of the capillarystructure and the external plate bodies will be affected. All theseissues have become the most important problems needing to be solved.

The vapor chamber and heat pipe are most often made of copper material.Copper has the properties of fast heat conduction and high ductility andmalleability. Therefore, a thinned copper plate or copper tube is apt todeform. After deformed, the vacuumed chamber of the vapor chamber andheat pipe is compressed, narrowed or collapsed. As a result, the workingfluid filled in the vacuumed chamber will be impossible to performvapor-liquid circulation work to transfer the heat.

Moreover, after thinned, the space of the vacuumed chamber is minified.Under such circumstance, it is a critical issue how to select acapillary structure disposed in the vacuumed chamber. It is harder forthe sintered powder to dispose in the narrow space. Therefore, somemanufacturers select thin mesh body as the capillary structure insteadof the sintered powder. However, it is still necessary to sinter thethin mesh body with the wall of the external plate body or tube body soas to prevent the mesh body from warping or sliding within the chamber.In the narrow vacuumed chamber, it is quite hard to sinter the capillarystructure with the wall of the chamber. Moreover, after sintered, itoften takes place that the vapor passage is blocked.

Furthermore, after compressed and deformed, the conventional capillarystructure disposed in the narrow space, such as sintered powder or wovenmesh body will fail to effectively control the flow distribution of theliquid in three-dimensional directions (axial direction and radialdirection). Also, the vapor cannot leave the capillary structure. As aresult, the resistance against the vapor and the liquid cannot bereduced. This will interrupt the vapor-liquid circulation and the heatof the heat source in contact with the vapor chamber or heat pipe cannotbe successfully conducted and dissipated to cause heat crash or burnoutof the chip. In addition, the conventional capillary structure such asthe sintered powder or woven mesh body cannot set up a vapor-liquidseparation heat flow structure. In the vapor chamber, the flow directionof the vapor is reverse to the flow direction of the liquid so that asplash phenomenon between the vapor and the liquid often takes place toincrease the resistance against the vapor and the liquid.

It is therefore tried by the applicant to provide a middle member ofheat dissipation device and the heat dissipation device to solve theabove problems existing in the conventional thinned heat dissipationdevice.

SUMMARY OF THE INVENTION

It is therefore a primary object of the present invention to provide amiddle member of heat dissipation device, which has a thin capillarystructure with better capillary attraction.

The middle member includes a middle member main body having a firstface, a second face, multiple perforations and a channeled structure.The channeled structure is disposed on the first face or the secondface. The perforations are formed through the middle member main bodybetween the first and second faces. The channeled structure and theperforations are arranged in alignment with each other or not inalignment with each other.

It is a further object of the present invention to provide a heatdissipation device including a middle member, a first plate body and asecond plate body.

The middle member includes a middle member main body having a firstface, a second face, multiple perforations and a channeled structure.The channeled structure is disposed on the first face or the secondface. The perforations are formed through the middle member main bodybetween the first and second faces. The channeled structure and theperforations are arranged in alignment with each other or not inalignment with each other.

The first plate body has a first surface and a second surface. Thesecond plate body has a third surface and a fourth surface. The firstand third surfaces are correspondingly mated with each other to togetherdefine a closed chamber. The middle member main body is disposed in theclosed chamber and a working fluid is filled in the closed chamber.

According to the above arrangement, one single thin sheet of middlemember main body is disposed between the first and second plate bodies.The channeled structure is disposed on one face or both faces of themiddle member main body. The channeled structure and the perforationsare arranged in alignment with each other or not in alignment with eachother. The middle member main body provides a complex capillarystructure for vapor-liquid circulation of the working fluid. Inaddition, the middle member main body serves as a support structureintegrated with the capillary structure.

BRIEF DESCRIPTION OF THE DRAWINGS

The structure and the technical means adopted by the present inventionto achieve the above and other objects can be best understood byreferring to the following detailed description of the preferredembodiments and the accompanying drawings, wherein:

FIG. 1 is a perspective view of a first embodiment of the middle memberof heat dissipation device of the present invention;

FIG. 2 is a plane view of the first embodiment of the middle member ofheat dissipation device of the present invention;

FIG. 3 is a perspective view of a second embodiment of the middle memberof heat dissipation device of the present invention;

FIG. 4 is another perspective view of the second embodiment of themiddle member of heat dissipation device of the present invention;

FIG. 5 is a perspective view of a third embodiment of the middle memberof heat dissipation device of the present invention;

FIG. 6 is another perspective view of the third embodiment of the middlemember of heat dissipation device of the present invention;

FIG. 7 is a perspective view of a fourth embodiment of the middle memberof heat dissipation device of the present invention;

FIG. 8 is another perspective view of a third embodiment of the middlemember of heat dissipation device of the present invention;

FIG. 8a is another perspective view of a third embodiment of the middlemember of heat dissipation device of the present invention;

FIG. 9 is a sectional view of a first embodiment of the heat dissipationdevice of the present invention;

FIG. 10a is a sectional view of a second embodiment of the heatdissipation device of the present invention;

FIG. 10b is a sectional view of the second embodiment of the heatdissipation device of the present invention;

FIG. 11a is a view showing the microstructure of the second plate bodyof the heat dissipation device of the present invention;

FIG. 11b is a view showing the microstructure of the second plate bodyof the heat dissipation device of the present invention;

FIG. 11c is a view showing the microstructure of the second plate bodyof the heat dissipation device of the present invention;

FIG. 11d is a view showing the microstructure of the second plate bodyof the heat dissipation device of the present invention;

FIG. 12a is a view of a fifth embodiment of the middle member of heatdissipation device of the present invention; and

FIG. 12b is another view of a fifth embodiment of the middle member ofheat dissipation device of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Please refer to FIGS. 1 and 2. FIG. 1 is a perspective view of a firstembodiment of the middle member of heat dissipation device of thepresent invention. FIG. 2 is a plane view of the first embodiment of themiddle member of heat dissipation device of the present invention.According to the first embodiment, the middle member of heat dissipationdevice of the present invention includes a middle member main body 1.

The middle member main body 1 has a first face 11, a second face 12,multiple perforations 13 and a channeled structure 14. The channeledstructure 14 can be disposed on the first face 11, the second face 12 orboth the first and second faces 11, 12. In this embodiment, thechanneled structure 14 is disposed on the first face 11. Theperforations 13 are formed through the middle member main body 1 betweenthe first and second faces 11, 12. The channeled structure 14 and theperforations 13 are arranged in alignment with each other or not inalignment with each other. In this embodiment, the channeled structure14 and the perforations 13 are, but not limited to, arranged not inalignment with each other for illustration purposes.

The channeled structure 14 has multiple recesses 141. The recesses 141are arranged at intervals and recessed from the first face 11 to thesecond face 12. The perforations 13 and the recesses 141 arehorizontally arranged not in alignment with each other or verticallyarranged and overlapped with each other. In this embodiment, theperforations 13 and the recesses 141 are, but not limited to,horizontally arranged not in alignment with each other for illustrationpurposes. The perforations 13 are formed between each four adjacentrecesses 141. At least one communication passage 141 a is formed betweeneach two recesses 141. Two ends of the communication passage 141 a areserially connected with the recesses 141, whereby the recesses 141 aretransversely and longitudinally communicated with each other.

Please now refer to FIGS. 3 and 4. FIG. 3 is a perspective view of asecond embodiment of the middle member of heat dissipation device of thepresent invention. FIG. 4 is another perspective view of the secondembodiment of the middle member of heat dissipation device of thepresent invention. The second embodiment is different from the firstembodiment in that the channeled structure 14 has multiple bosses 142.The bosses 142 are arranged in array at intervals. The bosses 142 definemultiple channels 143 therebetween. The perforations 13 and the bosses142 are horizontally arranged in alignment with or not in alignment witheach other (or vertically arranged and overlapped with each other). Inthis embodiment, the perforations 13 and the bosses 142 are, but notlimited to, arranged not in alignment with each other for illustrationpurposes. The channels 143 are disposed on the first face 11 in thelongitudinal direction of the middle member main body 1 or in thetransverse direction of the middle member main body 1 or in both thelongitudinal and transverse directions of the middle member main body 1to intersect each other.

Please now refer to FIGS. 5 and 6. FIG. 5 is a perspective view of athird embodiment of the middle member of heat dissipation device of thepresent invention. FIG. 6 is another perspective view of the thirdembodiment of the middle member of heat dissipation device of thepresent invention. The third embodiment is different from the secondembodiment in that the middle member main body 1 is defined with a firstsection 1 a, a second section 1 b and a third section 1 c. Two ends ofthe first section 1 a are connected with the second and third sections 1b, 1 c. The width of the channels 143 between the bosses 142 of thefirst section 1 a is smaller than the width of the channels 143 betweenthe bosses 142 of the second and third sections 1 b, 1 c. (That is, thebosses 142 of the first section 1 a are more densely arranged than thebosses 142 of the second and third sections 1 b, 1 c). The diameter ofthe perforations 13 of the first section 1 a is smaller than thediameter of the perforations 13 of the second and third sections 1 b, 1c. The first section 1 a is an evaporation section, while the second andthird sections 1 b, 1 c are condensation sections. The volume of thebosses 142 of the first section 1 a is smaller than the volume of thebosses 142 of the second and third sections 1 b, 1 c. Accordingly, thewidth of the channels 143 of the first section 1 a is smaller than thewidth of the channels 143 of the second and third sections 1 b, 1 c.(That is, the bosses 142 of the first section 1 a are more denselyarranged than the bosses 142 of the second and third sections 1 b, 1 c).

Please now refer to FIGS. 7, 8 and 8 a. FIG. 7 is a perspective view ofa fourth embodiment of the middle member of heat dissipation device ofthe present invention. FIG. 8 is another perspective view of a thirdembodiment of the middle member of heat dissipation device of thepresent invention. FIG. 8a is another perspective view of a thirdembodiment of the middle member of heat dissipation device of thepresent invention. The fourth embodiment is different from the firstembodiment in that the first and second faces 11, 12 of the middlemember main body 1 are both formed with channeled structures 14. Thechanneled structures 14 can be multiple recesses 141 or multiple bosses142 or a combination of multiple recesses 141 and multiple bosses 142.In this embodiment, the channeled structures 14 are, but not limited to,multiple bosses 142 for illustration purposes. In a modified embodiment,the channeled structures 14 are a combination of multiple bosses 142 andmultiple perforations 13, which are irregularly randomly arranged. Theconfiguration and the size of the bosses 142 and the perforations 13 arenot specifically limited (as shown in FIG. 8a ).

In the above embodiments, the cross section of the recesses 141 or thebosses 142 has, but not limited to, a geometrical configuration selectedfrom a group consisting of circular, elliptic, quadrangular, rhombic andtriangular configuration. The cross section means the cross-sectionalshape horizontally extending along the first face 11 or the second face12 of the middle member main body 1. The middle member main body 1 ismade of a material selected from a group consisting of pure titanium,titanium alloy, copper, aluminum, stainless steel, ceramic material,aluminum alloy and copper alloy.

Please now refer to FIG. 9, which is a sectional view of a firstembodiment of the heat dissipation device of the present invention.According to the first embodiment, the heat dissipation device of thepresent invention includes a middle member main body 1, a first platebody 2 and a second plate body 3.

The middle member main body 1 has a first face 11, a second face 12,multiple perforations 13 and a channeled structure 14. The channeledstructure 14 is disposed on the first face 11 or the second face 12. Theperforations 13 are formed through the middle member main body 1 betweenthe first and second faces 11, 12. The channeled structure 14 and theperforations 13 are arranged in alignment with each other or not inalignment with each other or vertically arranged and overlapped witheach other.

The first plate body 2 has a first surface 21 and a second surface 22.The second plate body 3 has a third surface 31 and a fourth surface 32.The first and third surfaces 21, 31 are correspondingly mated with eachother to together define a closed chamber 33. The middle member mainbody 1 is disposed in the closed chamber 33. A working fluid 4 is filledin the closed chamber 33.

In this embodiment, the channeled structure 14 of the middle member mainbody 1 is composed of multiple recesses 141 or multiple bosses 142. Thechanneled structure 14 can be selectively disposed on the first face 11,the second face 12 or both the first and second faces 11, 12. In thisembodiment, the channeled structure 14 is, but not limited to, onlydisposed on the second face 12 and the channeled structure 14 is, butnot limited to, composed of multiple bosses 142 for illustrationpurposes. The first surface 21 of the first plate body 2 has multipleraised sections 211. The second surface 22 is formed with multipledepressions in positions opposite to the raised sections 211. The raisedsections 211 are correspondingly attached to the second face 12 of themiddle member main body 1. The third surface 31 of the second plate body3 is correspondingly attached to the first face 11 of the middle membermain body 1.

Please now refer to FIGS. 10a and 10b , which are two sectional view ofa second embodiment of the heat dissipation device of the presentinvention. The second embodiment is different from the first embodimentin that the raised sections 211 of the first plate body 2 arecorrespondingly attached to the first face 11 of the middle member mainbody 1, while the third surface 31 of the second plate body 3 iscorrespondingly attached to the second face 12 of the middle member mainbody 1.

In the first and second embodiments of the heat dissipation device ofthe present invention, the second surface 22 of the first plate body 2is defined as a condensation face capable of providing condensationeffect. At least one section of the first surface 21 is defined as acondensation section 21 a. The fourth surface 32 of the second platebody 3 is defined as a heat absorption face 32 a capable of absorbingheat. At least one section of the third surface 31 is defined as anevaporation section 31 a. In this embodiment, the condensation section21 a and the evaporation section 31 a are up and down correspondinglyarranged.

The middle member main body 1 and the first and second plate bodies 2, 3are made of a material selected from a group consisting of puretitanium, titanium alloy, copper, aluminum, stainless steel, ceramicmaterial and any combination of the aforesaid materials.

Please now refer to FIG. 10b . In a modified embodiment, the channeledstructure 14 is disposed on the first face 11 of the middle member mainbody 1. The surface of the channeled structure 14 has a nanometerstructure layer 144. The nanometer structure layer 144 is nanometerwhisker layer or nanometer carbonized layer or nanometer oxidizationlayer. The nanometer oxidization layer is copper oxide, titanium oxideor aluminum oxide. The channeled structure 14 is correspondinglyattached to the third surface 31 of the second plate body 3. Thenanometer structure layer 144 serves to enhance the backflow or watersucking ability of the whole capillary structure.

Please now refer to FIGS. 11a, 11b, 11c and 11d . In the first andsecond embodiments of the heat dissipation device of the presentinvention, a microstructure 34 is disposed on the third surface 31 ofthe second plate body 3. The microstructure 34 is, but not limited to, arough face composed of multiple channels (as shown in FIG. 11a ) ormultiple pits and multiple protrusions (as shown in FIG. 11b ) or asintered powder layer (as shown in FIG. 11c ) or a coating layer (asshown in FIG. 11d ) or a complex structure of any combination thereof.The microstructure 34 serves to increase the water content so as toenhance the efficiency of vapor-liquid circulation. The coating layer isa hydrophobic layer or a hydrophilic layer. Certainly, a microstructureas the microstructure 34 of the second plate body 3 can be also disposedon the first surface 21 of the first plate body 2.

In this embodiment, the microstructure 34 is composed of multiplemicro-channels for illustration purposes. The middle of the thirdsurface 31 of the second plate body 3 is, but not limited to, defined asan evaporation section 23. Either or both of the left end and the rightend of the third surface 31 of the second plate body 3 relative to theevaporation section 23 are, but not limited to, defined as condensationends 24, 25. Certainly, the left end can be alternatively defined as theevaporation section 23, while the right end can be alternatively definedas a condensation end.

In this embodiment, the intervals between the micro-channels 341disposed on the evaporation section 23 are smaller and themicro-channels 341 are more densely arranged, while the micro-channels341 disposed on the condensation ends 24, 25 are more sparsely arranged.

In the case that a coating layer is disposed on the second plate body 2,the coating layer disposed on the evaporation section 23 is selectivelya hydrophilic coating layer, while the coating layer disposed on thecondensation ends 24, 25 are selectively hydrophobic coating layers.

The microstructure 34 (coating layers or micro-channels) mainly servesto enhance the water sucking force to help in increasing the watercontent of the evaporation section 23 so as to avoid dry burn. Themicro-channels 341 are diverged from the middle to the two condensationends 24, 25 so that the intervals between the micro-channels 341 at thecondensation ends 24, 25 are larger, that is, the micro-channels 341 atthe condensation ends 24, 25 are more sparsely arranged. Accordingly,the pressure impedance of the condensation ends 24, 25 is reduced toenhance the condensation diffusion efficiency.

Please now refer to FIGS. 12a and 12b . FIG. 12a is a view of a fifthembodiment of the middle member of heat dissipation device of thepresent invention. FIG. 12b is another view of a fifth embodiment of themiddle member of heat dissipation device of the present invention. Thefifth embodiment is different from the first embodiment in that theperforations 13 have multiple connection passages 131 in horizontaldirection. The connection passages 131 horizontally extend to connecttwo adjacent perforations 13 in a linear form, a curve form or anirregular form. The connection passages 131 are disposed on any of thefirst and second faces 11, 12 or both the first and second faces 11, 12.In this embodiment, the connection passages 131 are, but not limited to,disposed on the second face 12 (as shown in FIG. 12a ) or disposedbetween the first and second faces 11, 12 of the middle member main body1 (as shown in FIG. 12b ) for illustration purposes. The connectionpassages 131 permit the perforations 13 to also communicate with eachother in horizontal direction. That is, when the working fluid 4 isconverted into vapor phase, the working fluid 4 not only can spread invertical direction, but also can spread in horizontal direction.

In the present invention, the channeled structure 14 is disposed on oneface or both faces of the plate-shaped middle member main body 1. Inaddition, the middle member main body 1 is formed with the perforations13. The channeled structure 14 is for the working fluid 4 to flow back,while the perforations 13 serve as the passage of the evaporated workingfluid 4. When the heat dissipation device is thinned, the space of theinternal closed chamber is narrowed so that it is hard to dispose thecapillary structure in the chamber. The plate-shaped middle member mainbody 1 of the present invention solves this problem. In addition, theplate-shaped middle member main body 1 is uneasy to warp so that themiddle member main body 1 can be used without sintering and fixing. Thecomplex structure of the middle member main body 1 has both the vaporcirculation passage and the capillary structure for the liquid to flowback on one single layer of substrate. This overcomes the shortcomingthat some metal materials such as titanium are uneasy to process intospecial capillary structure such as woven mesh. Also, the necessarycapillary structure can be quickly manufactured. Therefore, the problemof the selection of material is solved and the manufacturing time isshortened to greatly lower the manufacturing cost.

Moreover, the middle member main body 1 can serve as a support, wherebyafter thinned, the closed chamber can keep complete without beingdeformed under compression to lose the vapor-liquid circulation effect.

Furthermore, the plate-shaped middle member main body 1 of the presentinvention can solely provide three-dimensional vapor-liquid circulationpassages in axial direction and radial direction without the limitationof a narrow space. Therefore, the working fluid can keep havingthree-dimensional flowing space to ensure that the vapor-liquidcirculation is successfully continuously performed. In the capillarystructure of the present invention, the liquid can flow through thechannels 143, while the vapor is produced at the semilunar membrane ofthe surface of the perforation 13 and diffused within the closed chamber33 to form a vapor-liquid separation heat transfer structure.

The present invention has been described with the above embodimentsthereof and it is understood that many changes and modifications in suchas the form or layout pattern or practicing step of the aboveembodiments can be carried out without departing from the scope and thespirit of the invention that is intended to be limited only by theappended claims.

What is claimed is:
 1. A middle member of heat dissipation device,comprising a middle member main body, the middle member main body havinga first face, a second face, multiple perforations and a channeledstructure, the channeled structure being disposed on the first face orthe second face, the perforations being formed through the middle membermain body between the first and second faces, the channeled structureand the perforations being arranged in alignment with each other or notin alignment with each other.
 2. The middle member of heat dissipationdevice as claimed in claim 1, wherein the channeled structure hasmultiple recesses, the recesses being arranged at intervals and recessedfrom the first face to the second face, the perforations and therecesses being horizontally arranged not in alignment with each other,at least one communication passage being formed between each tworecesses, two ends of the communication passage being serially connectedwith the recesses.
 3. The middle member of heat dissipation device asclaimed in claim 1, wherein the channeled structure has multiple bosses,the bosses being arranged in array at intervals, the bosses definingmultiple channels therebetween, the perforations and the bosses beinghorizontally arranged not in alignment with each other or verticallyarranged corresponding to each other.
 4. The middle member of heatdissipation device as claimed in claim 3, wherein the channels aredisposed on the first face in a longitudinal direction of the middlemember main body or in a transverse direction of the middle member mainbody or in both the longitudinal and transverse directions of the middlemember main body to intersect each other.
 5. The middle member of heatdissipation device as claimed in claim 3, wherein the channels aredisposed on the first face in a longitudinal direction or in atransverse direction or in both the longitudinal and transversedirections to intersect each other.
 6. The middle member of heatdissipation device as claimed in claim 2, wherein the cross section ofthe recesses has a geometrical configuration selected from a groupconsisting of circular, elliptic, quadrangular, rhombic and triangularconfiguration, the cross section meaning the cross sectionalhorizontally extending along the first face or the second face of themiddle member main body.
 7. The middle member of heat dissipation deviceas claimed in claim 3, wherein the cross section of the bosses has ageometrical configuration selected from a group consisting of circular,elliptic, quadrangular, rhombic and triangular configuration, the crosssection meaning the cross sectional horizontally extending along thefirst face or the second face of the middle member main body.
 8. Themiddle member of heat dissipation device as claimed in claim 1, whereinthe middle member main body is made of a material selected from a groupconsisting of pure titanium, titanium alloy, copper, aluminum, stainlesssteel, ceramic material, aluminum alloy and copper alloy.
 9. The middlemember of heat dissipation device as claimed in claim 1, wherein thechanneled structure has multiple bosses, the bosses being arranged inarray at intervals, the bosses defining multiple channels therebetween,the middle member main body being defined with a first section, a secondsection and a third section, two ends of the first section beingconnected with the second and third sections, the intervals between thebosses of the first section being smaller than the intervals between thebosses of the second and third sections, the diameter of theperforations of the first section being smaller than the diameter of theperforations of the second and third sections, the first section beingan evaporation section, while the second and third sections beingcondensation sections.
 10. The middle member of heat dissipation deviceas claimed in claim 9, wherein the volume of the bosses of the firstsection is smaller than the volume of the bosses of the second and thirdsections.
 11. The middle member of heat dissipation device as claimed inclaim 1, wherein the channeled structure is disposed on both the firstand second faces of the middle member main body.
 12. The middle memberof heat dissipation device as claimed in claim 11, wherein the channeledstructure is composed of multiple recesses or multiple bosses ormultiple recesses and multiple bosses arranged at intervals.
 13. Themiddle member of heat dissipation device as claimed in claim 1, whereinthe perforations have multiple connection passages in horizontaldirection, the connection passages horizontally extending to connect twoadjacent perforations, the connection passages being disposed on any ofthe first and second faces or both the first and second faces ordisposed between the first and second faces of the middle member mainbody.
 14. The middle member of heat dissipation device as claimed inclaim 1, wherein the surface of the channeled structure has a nanometerstructure layer, the nanometer structure layer being nanometer whiskerlayer or nanometer carbonized layer or nanometer oxidization layer, thenanometer oxidization layer being copper oxide, titanium oxide oraluminum oxide.
 15. A heat dissipation device comprising: a middlemember main body, the middle member main body having a first face, asecond face, multiple perforations and a channeled structure, thechanneled structure being disposed on the first face or the second face,the perforations being formed through the middle member main bodybetween the first and second faces, the channeled structure and theperforations being arranged in alignment with each other or not inalignment with each other; a first plate body having a first surface anda second surface; and a second plate body having a third surface and afourth surface, the first and third surfaces being correspondingly matedwith each other to together define a closed chamber, the middle membermain body being disposed in the closed chamber, a working fluid beingfilled in the closed chamber.
 16. The heat dissipation device as claimedin claim 15, wherein the first surface of the first plate body hasmultiple raised sections, the second surface being formed with multipledepressions in positions opposite to the raised sections, the raisedsections being correspondingly attached to the first face of the middlemember main body, the third surface of the second plate body beingcorrespondingly attached to the second face of the middle member mainbody.
 17. The heat dissipation device as claimed in claim 15, whereinthe first surface of the first plate body has multiple raised sections,the second surface being formed with multiple depressions in positionsopposite to the raised sections, the raised sections beingcorrespondingly attached to the second face of the middle member mainbody, the third surface of the second plate body being correspondinglyattached to the first face of the middle member main body.
 18. The heatdissipation device as claimed in claim 15, wherein the second surface ofthe first plate body is defined as a condensation face, at least onesection of the first surface being defined as a condensation section,the fourth surface of the second plate body being defined as a heatabsorption face, at least one section of the third surface being definedas an evaporation section, the condensation section and the evaporationsection being up and down correspondingly arranged.
 19. The heatdissipation device as claimed in claim 15, wherein the middle membermain body and the first and second plate bodies are made of a materialselected from a group consisting of pure titanium, titanium alloy,copper, aluminum, stainless steel and ceramic material.
 20. The heatdissipation device as claimed in claim 15, wherein a microstructure isdisposed on the third surface of the second plate body, themicrostructure being a rough face composed of multiple channels ormultiple pits and multiple protrusions or a sintered powder layer or acoating layer, the coating layer being a hydrophobic layer or ahydrophilic layer.
 21. The heat dissipation device as claimed in claim15, wherein the channeled structure is disposed on both the first andsecond faces of the middle member main body.
 22. The heat dissipationdevice as claimed in claim 15, wherein at least one section of the thirdsurface of the second plate body is defined as an evaporation sectionand either or both of the left end and the right end of the thirdsurface relative to the evaporation section are defined as condensationends.
 23. The heat dissipation device as claimed in claim 15, whereinthe surface of the channeled structure has a nanometer structure layer,the nanometer structure layer being nanometer whisker layer or nanometercarbonized layer or nanometer oxidization layer, the nanometeroxidization layer being copper oxide, titanium oxide or aluminum oxide.24. The heat dissipation device as claimed in claim 23, wherein thechanneled structure is correspondingly attached to the third surface ofthe second plate body.